IPA-IAO Forschung und Praxis Agent Based Diagnostic System for the Defect Analysis during Chemical Mechanical Polishing (CMP)
نویسندگان
چکیده
منابع مشابه
A Contact-mechanics Based Model for Dishing and Erosion in Chemical-mechanical Polishing
We present a new model for dishing and erosion during chemical-mechanical planarization. According to this model, dishing and erosion is controlled by the local pressure distribution between features on the wafer and the polishing pad. The model uses a contact mechanics analysis based on the work by Greenwood to evaluate the pressure distribution taking into account the compliance of the pad as...
متن کاملAxiomatic Design of a Chemical Mechanical Polishing (CMP) Wafer Carrier with Zoned Pressure Control
Axiomatic Design was used to develop a complete platform for chemical mechanical polishing (CMP) of silicon wafers. A functional requirement of the machine emerging from the axiomatic design process is the control of the wafer-scale polishing uniformity. Mechanisms to maintain control of the uniformity were designed, and integrated into a wafer carrier, which holds the wafer during polishing an...
متن کاملControlled chemical mechanical polishing of polysilicon and silicon dioxide for single-electron device
In this article, the authors report experimental results of the chemical mechanical polishing CMP of silicon dioxide SiO2 and polysilicon to produce nanoscale features with very smooth surfaces. The sizes of the features polished ranged from 30 to 500 nm. For polysilicon polishing, the nanostructures were defined in positive tone e-beam resist and the pattern was transferred to the oxide substr...
متن کاملDevelopment of Device-Level Chemical-Mechanical Polishing Simulation Module Using Cellular Automata Method
This work briefly presents the basic theory, the development, and a primary demonstration of a devicelevel chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston’s equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effec...
متن کاملRecent Advances in Polishing of Advanced Materials
This article discusses the recent advances in polishing of advanced materials. Ninety-five journal articles published in 2005–2007 are briefly introduced. The topics are advances in chemical mechanical polishing (CMP), fluids for polishing, modeling of polishing, polishing of brittle materials, robotic polishing, polishing with vibrations or beams, and friction in polishing processes. CMP is pe...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2005